Stress in cMUT insulating layer Answered
I'm simulating a CMUT device. My silicon nitride layer has build-in thermal stress, more than 200 MPa.
Is there a way to incorporate this stress in the mechanical model, as a property of the layer ?
It has a very important contribution to the stiffness of the plate. In fact, in order to get the same stifness without thermal stress, i have to double the Young's Modulus.
thank you in advance