Stress in cMUT insulating layer Answered

I'm simulating a CMUT device. My silicon nitride layer has build-in thermal stress, more than 200 MPa.

Is there a way to incorporate this stress in the mechanical model, as a property of the layer ? 
It has a very important contribution to the stiffness of the plate. In fact, in order to get the same stifness without thermal stress, i have to double the Young's Modulus. 

thank you in advance

1 comment

  • Hi Cyril,

    Unfortunately we do not support pre-stressed materials. 

    Best Regards,


    Comment actions Permalink

Please sign in to leave a comment.

Didn't find what you were looking for?

New post